Dione 640 OEM | Low SWaP VGA Thermal Camera Core

Sensor Type

Microbolometer - VOx

Resolution - pixel pitch

640 x 512 - 12 µm

Sensitivity

8 - 14 µm

Shutter Mode

Rolling shutter

NEDT

<60 [at 30 Hz, 300 K, F/1]

Interface

16-bit DV, USB, MIPI CSI-2

Low SWaP VGA Thermal Camera Core

The Dione 640 OEM series is based on an uncooled 12 μm pitch microbolometer detector with a 640 x 512 resolution and NETD of less than 50 mK.

The cores are optimized for low SWaP (Size, Weight and Power). The overall size of the OEM core is 25 x 25 x 10 mm³ and weight is 6 grams. It utilizes Xenics image enhancement for advanced image processing while keeping power consumption low.

All Dione 640 versions have the same SAMTEC ST5 connector and are GenICam compliant.

The ultra-compact Dione 640 OEM series find application in safety and security systems, as well as in industrial thermal imaging systems.

Very low latency & real trigger

Latency <100 µs for real-time information, accurate targeting and immediate reaction

Benefits & Features

• Low SWaP (Size, Weight and Power)
• GenICam compliant
• Shutterless and uncooled operation

Sensor Specs
Sensor Type	Microbolometer
Resolution - pixel pitch	640 x 480 pixels - 12 µm
Max Frame Rate Full Frame	60
Sensitivity	8 - 14 µm
Integration time	20 - 65 µs
Windowing	No
A/D Converter	14 bit
Cooling	Uncooled

Noise Figures
NEDT	<50 mK or <40 mK [at 30 Hz, 300 K, F/1]

Interface, Connector type, Size, Weight & Power
Interface	Connector type	Size	Weight	Power consumption
16-bit DV	SAMTEC ST5-30-1.50-L-D-P-TR	25 x 25 x 10 mm3	6 g	0.75 Hz (60 Hz)
MIPI CSI-2	22-pin FFC/FPC connector (Molex)	25 x 25 x 16.5 mm3	9 g	< 1.1 W
USB	Type B USB 3.0	25x25x18mm3	10 g	< 1.3 W
UVC	80-pin Hirose DF40C-80DP- 0.4V (51)	25x25x16mm3	10 g	< 1.32 W

Environmental specifications
Operating temperature range	From -40 to +70 (16bit DV, UVC and USB); From -30 to +70 (MIPI CSI-2)
Storage temperature	From -45 to +85(16bit DV, UVC); From -40 to +85 (USB); From -30 to +85 (MIPI CSI-2)
Shock	40 g, 11 ms, MIL-STD810G
Vibration	5 g (20 to 2000 Hz), MIL-STD810G

Transportation

Safety/Security

Process Monitoring

Data Sheet & Brochures

Dione-1280-CAM-Series-Data Sheet

Xeneth Software

Versatile software interface designed with the user in mind

Xeneth handles all Xenics infrared cameras regardless of wavelength sensitivity, interface, resolution and image format. The default view of the GUI (Graphical User Interface) will only show the key control parameters next to the infrared camera image. Upon changing the view from beginner, over expert to guru, extra settings become visible and adjustable.

An entire set of processing and post-processing tools is available to extract all useful information and to optimize your infrared images. When using a thermally calibrated camera (for selected cameras only!), the software is capable of doing a complete radiometric analysis (thermography) that takes object, environmental and optic characteristics into account.

Furthermore Xeneth lets you export recorded infrared images to common image formats which can be viewed and analyzed in 3^rd party software. Another new feature of Xeneth (available from version 2.7) is the extended calibration wizard which lets you easily optimize image correction calibration data without using real-time camera images.

Features

Alarms
Black hot/White hot spots
Extended calibration wizard
Image histogram
Image processing
Recorder and player
Store & analyze digital images/movies
TrueNUC for continuous real-time image correction
Bad pixel replacement
Easy control of all Xenics infrared cameras
False color mode with various color profiles
Image live view
Line profiles, spot meters, time profiles
Selections and statistics
Thermography (optional and for selected cameras only)
Xeneth LabVIEW SDK (optional)
Xeneth Software Development Kit (SDK)

Description
Additional information

Low SWaP VGA Thermal Camera Core

Ultra low SWaP (25 x 25 x 10 mm, 6 gr, 800 mW) thermal imaging single-board camera core with 12 µm pitch. 640 x 512 @ 60 Hz uncooled operation

The overall size of the OEM core is 25 x 25 x 10 mm³ and weight is 9 gr. It utilizes Xenics image enhancement for advanced image processing while keeping power consumption low.

All Dione 640 versions thermal imaging cores have the same SAMTEC ST5 connector and are GenICam compliant.

The ultra-compact Dione 640 OEM thermal camera core series find application in safety and security systems, as well as in industrial thermal imaging systems.

Benefits & Features
• State-of-the-art 640 × 512 microbolometer detector with 12 μm pitch
• Low SWaP (Size, Weight and Power)
• GenICam compliant
• Shutterless and uncooled operation

Sensitivity	8 – 14 µm
Material	VOx
Resolution	640 x 480
Pixel Pitch	12 µm x 12 µm
Frame Rate Full Frame	60 Hz full frame
Cooling	Uncooled / TEC-less
Interface	USB, MIPI CSI-2, 16-bit DV

Dione 640 OEM | Low SWaP VGA Thermal Camera Core

Low SWaP VGA Thermal Camera Core

Very low latency & real trigger

Xeneth Software

Features

Low SWaP VGA Thermal Camera Core

Shop related products…

Dione 640 CAM | VGA Uncooled LWIR Camera

Dione S 640 CAM | VGA Shuttered Uncooled LWIR camera

Dione 1280 OEM | Low SWaP SXGA Thermal Camera Core

Address

Contact

Social

Products

Applications

About