Dione 640 OEM Series | VGA Uncooled LWIR camera core

Sensor Type

Microbolometer - VOx

Resolution - pixel pitch

640 x 512 - 12 µm

Sensitivity

8 - 14 µm

Shutter Mode

Rolling shutter

NEDT

<60 [at 30 Hz, 300 K, F/1]

Interface

CameraLink, UVC, MIPI CSI-2

Ultra low SWaP, single-board thermal imaging core

The Dione 640 OEM series is based on an uncooled 12 μm pitch microbolometer detector with a 640 x 512 resolution and NETD of less than 50 mK.

The cores are optimized for low SWaP (Size, Weight and Power). The overall size of the OEM core is 25 x 25 x 10 mm3 and weight is 6 grams. It utilizes Xenics image enhancement for advanced image processing while keeping power consumption low.

All Dione 640 versions have the same SAMTEC ST5 connector and are GenICam compliant.

The ultra-compact Dione 640 OEM series find application in safety and security systems, as well as in industrial thermal imaging systems.

Very low latency & real trigger

Latency <100 µs for real-time information, accurate targeting and immediate reaction

Benefits & Features

• Low SWaP (Size, Weight and Power)
• GenICam compliant
• Shutterless and uncooled operation

Ultra low SWaP uncooled thermal camera core

Ultra low SWaP (25 x 25 x 10 mm, 6 gr, 800 mW) thermal imaging single-board camera core with 12 µm pitch. 640 x 512 @ 60 Hz uncooled operation

The overall size of the OEM core is 25 x 25 x 10 mm3 and weight is 9 gr. It utilizes Xenics image enhancement for advanced image processing while keeping power consumption low.

All Dione 640 versions thermal imaging cores have the same SAMTEC ST5 connector and are GenICam compliant.

The ultra-compact Dione 640 OEM thermal camera core series find application in safety and security systems, as well as in industrial thermal imaging systems.

Benefits & Features
• State-of-the-art 640 × 512 microbolometer detector with 12 μm pitch
• Low SWaP (Size, Weight and Power)
• GenICam compliant
• Shutterless and uncooled operation

Sensitivity

8 – 14 µm

Material

VOx

Resolution

640 x 480

Frame Rate

10 – 100 fps

Cooling

Uncooled / TEC-less

Pixel Pitch

12 µm x 12 µm

Type

Core/module

Interface

USB, Camera Link, MIPI CSI-2

Array Type

2D array / areascan

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