Low SWaP VGA Thermal Camera Core
Ultra low SWaP (25 x 25 x 10 mm, 6 gr, 800 mW) thermal imaging single-board camera core with 12 µm pitch. 640 x 512 @ 60 Hz uncooled operation
The overall size of the OEM core is 25 x 25 x 10 mm3 and weight is 9 gr. It utilizes Xenics image enhancement for advanced image processing while keeping power consumption low.
All Dione 640 versions thermal imaging cores have the same SAMTEC ST5 connector and are GenICam compliant.
The ultra-compact Dione 640 OEM thermal camera core series find application in safety and security systems, as well as in industrial thermal imaging systems.
Benefits & Features
• State-of-the-art 640 × 512 microbolometer detector with 12 μm pitch
• Low SWaP (Size, Weight and Power)
• GenICam compliant
• Shutterless and uncooled operation